# Senior Integrated Photonics Packaging Engineer (Photonics) at Q.ANT

> Open job at Q.ANT in Stuttgart, Germany. Workplace: On-site.

Source: Germany Dev Jobs, https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-photonics-az7i52f
Posted 22 July 2026. Last checked on the employer's career site: 10 November 2026.

## Facts

- Company: [Q.ANT](https://germanydevjobs.com/companies/q-ant)
- Location: Stuttgart, Germany
- Workplace: On-site
- Employment type: Full-time
- German: Not required
- English: Fluent
- Not mentioned in the job post: salary, visa sponsorship, relocation, where you can apply from

## Job description

#### Your mission

The future of AI computing is light, not electrons.
Q.ANT is building photonic processing systems that compute with light—delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.

As **Senior Integrated Photonics Packaging Engineer** within our PIC OPS team, you will take technical ownership of the optical packaging architecture. You will be the technical mastermind behind proprietary, high-density optical packaging solutions that unite Photonic Integrated Circuits (PICs), laser sources, photodetectors, and analog circuitry in semiconductor back-end integration. By defining technical strategies, leading supplier-driven R&D projects, and driving innovation from specification to validation, you will build competitive differentiators that shape the future of AI computing infrastructure.

**Your Impact & Responsibilities**

- Define and own the optical packaging architecture and high-density packaging solutions for our photonic processing systems
- Lead supplier-driven R&D projects from requirement definition and contract negotiation through to final system integration
- Define and implement advanced optical coupling strategies (butt-coupling, grating coupling, fiber array integration) and thermal management concepts
- Drive Design for Manufacturability (DFM) and material selection (polymers, ceramics, metals) in semiconductor back-end integration
- Perform structured root-cause analysis (8D, Ishikawa) on integration failures to ensure ≥95% first-pass qualification
- Implement novel packaging concepts and architectures annually to build and protect proprietary Q.ANT IP
- Collaborate closely with internal R&D, systems, manufacturing, and test teams to align packaging with overall product architecture.

#### Your profile

- M.Sc. or Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field; equivalent industry experience also considered
- 5+ years of hands-on experience in photonics packaging, optoelectronic integration, or high-density interconnect technologies
- Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation
- Deep hands-on experience with PICs, laser sources, photodetectors, analog electronics, and semiconductor back-end integration
- Solid expertise in optical coupling techniques (butt-coupling, grating coupling, fiber arrays), thermal management, and DFM
- Proficiency in optical design tools (Zemax, CODE V, or equivalent) and root-cause analysis methodologies (8D, Ishikawa)
- Proactive mindset with strong ownership, high emotional intelligence for supplier management, and a collaborative "team-first" attitude
- Fluent in English; knowledge of German or another European language is a plus

#### Why us?

- **Work on the leading edge:** Shape deep-tech evolution by developing proprietary, high-density packaging architectures that push the physical boundaries of computing.
- **Make impact at scale:** Protect Q.ANT's competitive edge—your DFM strategies and supplier quality controls directly reduce time-to-market risks and ensure high-yield production.
- **Broad decision-making authority:** Enjoy wide autonomy to define technical requirements, select global suppliers, manage budgets, and bring fresh packaging concepts into reality.
- **Fast-track your growth:** Solve challenges with few industry precedents —every problem you solve becomes institutional knowledge and potentially industry-defining IP.
- **World-class team:** Collaborate with an international, cross-functional team of experts in photonics, processor design, and AI systems under the PIC OPS umbrella.
- **Direct access to leadership:** Work closely with the Head of PIC, company founders, andan advisoryboard that has shaped the semiconductor industry.

## How to apply

Apply on the job page, https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-photonics-az7i52f: its Apply button opens the employer's own application page.

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