# Senior Integrated Photonics Packaging Engineer (RF) (m/f/d) at Q.ANT > Open job at Q.ANT in Stuttgart, Germany. Workplace: On-site. Source: Germany Dev Jobs, https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-rf-m-f-d-pnbevll Posted 22 July 2026. Last checked on the employer's career site: 10 November 2026. ## Facts - Company: [Q.ANT](https://germanydevjobs.com/companies/q-ant) - Location: Stuttgart, Germany - Workplace: On-site - Employment type: Full-time - German: Not required - English: Fluent - Not mentioned in the job post: salary, visa sponsorship, relocation, where you can apply from ## Job description #### Your mission The future of AI computing is light, not electrons. At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing. As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology. **Your Impact & Responsibilities** - Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI) - Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation - Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques - Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up) - Execute thermal management strategies for high-power photonic and high-frequency devices - Establish quality assurance and verification protocols to achieve ≥95% first-pass qualification on supplier-delivered modules - Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP - Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture #### Your profile - M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered - 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies - Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation - Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding - Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI) - Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC) - Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills - Fluent in English; knowledge of German or another European language is a plus #### Why us? - **Work on the leading edge:** Shape deep-tech evolution by developing novel high frequency packaging architectures that push the physical boundaries of AI computing. - **Make impact at scale:** Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market. - **Broad decision-making authority:** Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies. - **Fast-track your growth:** Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP. - **World-class team:** Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems. - **Direct access to leadership:** Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry. ## How to apply Apply on the job page, https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-rf-m-f-d-pnbevll: its Apply button opens the employer's own application page. ## More jobs from Q.ANT - [Senior Photonic Engineer – Electro-Optic Modulator Design (TFLN) (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-photonic-engineer-electro-optic-modulator-design-tfln-rlqotdl): Q.ANT, Stuttgart, Germany. On-site. Posted 15 October 2026. - [Senior Integrated Photonics Packaging Engineer (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-m-f-d-1my1um2): Q.ANT, Stuttgart, Germany. On-site. Posted 9 October 2026. - [Native Processing Server Engineer (m/f/d)](https://germanydevjobs.com/jobs/q-ant-native-processing-server-engineer-m-f-d-xzieqid): Q.ANT, Stuttgart, Germany. On-site. Posted 30 July 2026. - [Senior Integrated Photonics Packaging Engineer (Photonics)](https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-photonics-az7i52f): Q.ANT, Stuttgart, Germany. On-site. Posted 22 July 2026. - [Senior Embedded Linux Engineer (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-embedded-linux-engineer-m-f-d-7x8grbz): Q.ANT, Stuttgart, Germany. On-site. Posted 7 July 2026.