# (Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d) at Q.ANT > Open job at Q.ANT in Stuttgart, Germany. Workplace: On-site. Source: Germany Dev Jobs, https://germanydevjobs.com/jobs/q-ant-senior-pic-design-engineer-architecture-fiber-coupling-f-m-d-4kn3q2j Posted 23 April 2026. Last checked on the employer's career site: 11 November 2026. ## Facts - Company: [Q.ANT](https://germanydevjobs.com/companies/q-ant) - Location: Stuttgart, Germany - Workplace: On-site - Employment type: Full-time - German: Not required - English: Fluent - Skills: Python - Not mentioned in the job post: salary, visa sponsorship, relocation, where you can apply from ## Job description #### Your mission The future of AI computing builds on light. Q.ANT is building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. Q.ANT’s photonic integrated circuits are at the heart of this technology. You will drive the design, development, and optimisation of advanced PIC components - with a particular focus on state-of-the-art fiber-to-chip coupling and photonic packaging - driving solutions from initial concept through layout, fabrication, and production-ready integration. As a technical lead for specific PIC components, you will drive innovation across the full photonic integration lifecycle, define design methodologies, and coordinate cross-functional teams from concept to production. Your expertise in fiber-to-chip coupling and packaging will directly distinguish Q.ANT’s photonic solutions and shape the company’s technology roadmap. Location: Stuttgart, Germany Type: Permanent employment, full-time Work mode: Onsite with max. 1 day remote work per week **What You Will Do** - Drive the development of state-of-the-art fiber-to-chip coupling solutions for industry environments - driving mode matching, loss budget optimisation, and packaging integration from component design through production-ready delivery• Lead the design, prototyping, and validation of specific photonic chip components - from concept through layout, tape-out coordination, fabrication, and packaging - ensuring all deliverables meet performance specifications and schedule targets - Implement photonic computing architectures on chip; drive innovation and new technology development in the PIC domain, proposing novel components and integration strategies that feed directly into Q.ANT’s product and technology roadmap - Coordinate cross-disciplinary engineering projects (design, development, integration, testing) from concept to production - working closely with packaging, test, and foundry teams; collect and consolidate specifications from stakeholders and translate them into circuit definitions - Mentor junior engineers and technicians; provide technical guidance and ensure effective collaboration across all project phases - Present complex technical findings and design decisions to both technical peers and executive-level stakeholders with clarity and precision #### Your profile **Required:** - Strong academic foundation in Photonics, Electrical Engineering, Applied Physics, or a related field (Master’s degree or PhD); equivalent industry experience considered - 3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination - In-depth expertise in fiber-to-chip coupling interfaces, including mode matching, packaging constraints, and loss budget management - Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent) with demonstrated ability to produce design-ready simulation outputs - Solid practical experience with a PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda) and advanced Python skills applied to photonic design workflows - automation, simulation scripting, and data analysis - Solid grounding in optical device characterization techniques and interpretation of optical/electrical test data - Proven ability to coordinate cross-functional technical investigations across teams without formal authority and strong communication skills at both technical and executive level - Proven track record collecting and consolidating specifications from stakeholders and translating them into circuit definitions - Fluent English; German is beneficial - working language in the team is English **Nice to have:** None of the following are required - they are genuine bonuses and we do not expect any one candidate to bring all of them: - First experimental experience with TFLN / LNOI - Understanding of AI or high-speed optical communication system requirements for PICs - Knowledge of mixed-signal and photonic/electronic co-packaging challenges - Experience with foundry collaboration and process transfer to external manufacturing partners #### Why us? - Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes, high impact from day one - Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing - Own your work from day one: Shape characterization strategies, integration workflows, and roadmap inputs on your own, with direct impact on product success - Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP - World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, electronics, and packaging - Direct access to leadership: Work closely with the company’s founders, including CEO Dr. Michael Förtsch, and the Q.ANT senior leadership team - Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving - Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation We are looking for a hands-on senior engineer who gets energized by designing and delivering advanced PIC components, pioneering fiber-to-chip coupling solutions, and directly shaping next-generation photonic technology. Ready to push the boundaries of what photonic integrated circuits can do? We are looking forward to receiving your application! _Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees._ ## How to apply Apply on the job page, https://germanydevjobs.com/jobs/q-ant-senior-pic-design-engineer-architecture-fiber-coupling-f-m-d-4kn3q2j: its Apply button opens the employer's own application page. ## More jobs from Q.ANT - [Senior Photonic Engineer – Electro-Optic Modulator Design (TFLN) (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-photonic-engineer-electro-optic-modulator-design-tfln-rlqotdl): Q.ANT, Stuttgart, Germany. On-site. Posted 15 October 2026. - [Senior Integrated Photonics Packaging Engineer (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-m-f-d-1my1um2): Q.ANT, Stuttgart, Germany. On-site. Posted 9 October 2026. - [Native Processing Server Engineer (m/f/d)](https://germanydevjobs.com/jobs/q-ant-native-processing-server-engineer-m-f-d-xzieqid): Q.ANT, Stuttgart, Germany. On-site. Posted 30 July 2026. - [Senior Integrated Photonics Packaging Engineer (RF) (m/f/d)](https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-rf-m-f-d-pnbevll): Q.ANT, Stuttgart, Germany. On-site. Posted 22 July 2026. - [Senior Integrated Photonics Packaging Engineer (Photonics)](https://germanydevjobs.com/jobs/q-ant-senior-integrated-photonics-packaging-engineer-photonics-az7i52f): Q.ANT, Stuttgart, Germany. On-site. Posted 22 July 2026.